Silver Conductive Paste | Opto-Electronic | Product | 立承德科技 | NEXTECK

立承德科技 | NEXTECK

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Silver Conductive Paste Over a decade of experience in manufacturing silver conductive paste,is sure to be the first choice for your sourcing need. We offer high quality product with competitive price in a prompt delivery.
Key Features of our Silver Conductive Paste:	Applications:
1. Excellent dispensability.　　 2. Low bleed-out. 3. Low condensable volatiles. 4. Fast curing. 5. Slow drying. 6. Low water absorption.	1. LED　　 2. Laser diodes 3. RF parts 4. High power MMICs 5. High power hybrids and modules 6. Metallic solder die attach

1000 Hrs Life ( Recommended processing temperatures： 30 minutes @ 150^oC )

Typical Characteristics of High Power Conductive Paste:
Filler Type	Silver (Ag)	Storage Condition	Below 0^oC
Total Solid Content	94.5±1%	Shelf Life	Approx. 3 months
Viscosity at 25^oC	Typical 18,000 ± 2,000cps (Brookfield CP5@5rpm) Note: Customization upon request	Package	20 g/each，16 per box
Resistivity (150 for 0.5 hrs)	< 50 m/sq./mil	Weight Lost (After Cure at 260^oC)	< 0.1%
Thermal Conductivity (20~25^oC)	> 60 Watt/(m^oK)	Thermal Expansion	20~40 ppm/^oC

Typical Characteristics of Low Power Conductive Paste
Filler Type	Silver (Ag)	Thermal Conductivity (20~25^oC)	> 60 Watt/(m^oK)
Silver Content	90±1%	Storage Condition	Below 5
Total Solid Content	92.5±1%	Shelf Life	Approx. 3 months
Viscosity at 25	18,000 ± 2,000cps (Brookfield CP5@5rpm) Note: Customization upon request	Package	20 g/each，16 per box
Resistivity (150 for 0.5 hrs)	< 50 m/sq./mil	Weight Lost (After Cure at 260^oC)	< 0.1%