Dicing Tape - Pressure Sensitive Series -

Part Number :
F - 90
T - 80
T - 120
GE - 200

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.

We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Various product line
● standard type (AD series)
● high-performance to difficult-to-adhere workpiece (ＧＤ series)
● excellent stability against elapsed deterioration (Ｔ series)
● high-performance to laser-dicing (F-90)
● Easy pick-up with excellent expandability

Specification

Recommended Works	Part Number	Base Film	Color	Thickness (μm)	Adhesion Thickness (μm)	Adhesive Strength (N/20mm)	Probe Tack (N/20mm2)	Feature
Si GaAs Other Semiconductor	F-90MW	PO	MW	90	10	1	1	PVC-free type
	T-80MW	PVC		80		0.8	0.7	Excellent temporal stability
	T-80HW			80		1.7	1
	T-120HW			120		1.7	1
Thick Workpiece	20GE-200		LB	200		2.7	2.9	For thick workpiece

＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
＊Separator thickness is not included.

Dicing Tape - UV Series -

Part Number :
UDV - 80J / UDV - 100J / UHP - 110B
UHP - 0805MC / UHP - 1005M3
UHP - 110M3 / UHP - 1025M3
UHP - 1510M3 / UHP - 1525M3
USP - 1515M4 / USP - 1515MG
UDT - 1025MC / UDT - 1325D
UDT - 1915MC

A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.

Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.

We Toyo Adtec consider needs of each user and choose appropriate tapes.

Feature

● Excellent control to back-side chipping and chip fly-off.
● Excellent adhesiveness.
● Smooth peeling by UV.
● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

Specification

Recommended Work I	Si GaAs Other Semiconductor
Part Number	UDV- 80J	UDV- 100J	UHP- 110B	UHP- 0805MC	UHP- 1005M3	UHP- 110M3
Base film	PVC		PO
Color	T		MW
Thickness (μm)	80	100	110	85	105	110
Adhesion Thickness (μm)	10			5		10
Adhesive Strength (N/20mm)	3.8(0.2)	3.8(0.2)	2.9(0.2)	5.0(0.2)	5.0(0.2)	7.6(0.2)
Probe Tack (N/20mm2)	2.1(0.05)	2.1(0.05)	2.7(0.05)	1.7(0.05)	2.7(0.05)	3.9(0.05)
characteristic	Easy pickup			For less chipping		For small size chips

Recommended Work II	Package
Part Number	UHP-1025M3	UHP-1510M3	UHP-1525M3	USP-1515M4	USP-1515MG
Base film	PO
Color	MW
Thickness (μm)	125	160	175	165
Adhesion Thickness (μm)	25	10	25	15
Adhesive Strength (N/20mm)	12.0(0.2)	6.5(0.2)	13.5(0.2)	14.5(0.2)	15.0(0.2)
Probe Tack (N/20mm2)	5.5(0.05)	4.2(0.05)	5.6(0.05)	6.2(0.05)	5.9(0.05)
characteristic	For encapsulated workpiece For less backside burrs For less glue scratch-up on the chip side walls For less against residue onto a making area

Recommended Work III	Glass Crystal
Part Number	UDT-1025MC	UDT-1325D	UDT-1915MC
Base film	PET
Color	T
Thickness (μm)	125	155	203
Adhesion Thickness (μm)	25		15
Adhesive Strength (N/20mm)	30.0(0.2)	20.4(0.2)	20.3(0.2)
Probe Tack (N/20mm2)	7.5(0.05)	6.7(0.05)	5.9(0.05)
characteristic	For less backside cracking	For encapsulated workpiece	For less backside cracking

＊( ) is adhesive strength after UV.
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White), T (Transparent)
＊UV irradiate condition : Light volume=above 150mJ/cm2.
＊UV irradiate condition may change with dicing products.
＊Separator thickness is not included.